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DEEPX 2nm 低功耗 AI 芯片 DX-M2 实物芯片预计 2027 年初面世

Source IT之家7h ago
Summary

This item is a 中文-language original; headline and summary shown as published.

IT之家 11 月 11 日消息,韩国边缘能效 AI 芯片开发商 DEEPX 昨日宣布,其下一代芯片 DX-M2 荣获 CES 2027 人工智能类别创新奖。 DX-M2 基于三星晶圆代工 2nm 工艺,集成 80TOPs NPU 算力, 至高支持 128bit 的 LPDDR5X-9600 内存 ,可本地运行超 1…

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Desk
Tech
Region
China
Language
中文
Item ID
tech-26593944

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DEEPX 2nm 低功耗 AI 芯片 DX-M2 实物芯片预计 2027 年初面世 · Meridian Globe