日月光高雄路竹厂一期启用、二期动土，1000 亿新台币扩产先进封装
Source IT之家1h ago
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This item is a 中文-language original; headline and summary shown as published.
IT之家 11 月 13 日消息，半导体 OSAT（外包封测）龙头日月光今日举行高雄路竹厂一期启用暨二期动土典礼。该项目瞄准先进封装领域， 两期整体投资规模达 1,000 亿新台币 （ IT之家注：现汇率约合 203 亿元人民币） 。 IT之家了解到，日月光路竹厂总建筑面积近 26 万平方米，满载后年营收规模约 80…
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