国产再突破:中微公司首台等离子体晶圆切割设备成功交付国内重要集成电路封装客户
Source IT之家16h ago
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This item is a 中文-language original; headline and summary shown as published.
IT之家 11 月 10 日消息,中微半导体设备(上海)股份有限公司(简称“中微公司”)近日发布其全新产品 ——Primo Matrix 双反应台等离子体晶圆切割设备,今日宣布 首台设备已顺利付运国内重要集成电路封装客户 。 随着先进封装技术成为延续摩尔定律的重要路径,晶圆切割作为封装工艺中的关键环节,直接影响芯片良…
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- Tech
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- China
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- 中文
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- tech-ef7d9b35
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